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SP-Series

Products Main features
1、Surface Mount Solder Connection.
2、High thermal conductivity epoxy compound molding.
3、Fast recovery time for high efficiency.
4、J-Lead(Inner Bend) and Gullwing(Outer Bend), two different shapes available for you
5、Ultra small size package
6、Fast recovery SP Series are the different package size.

Products Main Parameters
(3~8KV; 40~750mA; 50~100nS)
Type Vrrm(KV) Io(mA) Trr(nS) Ifsm(A) Vfm(V) Irrm1/Irrm2(uA)
J-Lead(Inner Bend) Shapes
SP3S 3 120 100 5 3.9 1/20
SP3L 3 450 230 10 3.6 1/20
SP3A 3 750 350 15 3.2 1/20
SP5S 5 40 30 5 7.0 1/20
SP5L 5 270 200 10 8.0 1/20
SP5LF 5 270 200 10 7.6 1/20
Gullwing(Outer Bend) Shapes
SP3SG 3 120 100 5 3.9 1/20
SP3LG 3 450 230 10 3.6 1/20
SP3AG 3 750 350 15 3.2 1/20
SP5SG 5 40 30 5 7.0 1/20
SP5LG 5 270 200 10 8.0 1/20
SP5LFG 5 270 200 10 7.6 1/20
SP8SG 8 40 30 5 13.0 1/20
SP8LG 8 100 80 10 13.0 1/20
For other parameter requirements, please contact our customer service. [email protected]
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